A chip design firm reportedly builds deliberately weak server processors that fall below U.S. and South Korean export-control thresholds, then pairs them with high-end HBM memory from Samsung and SK hynix that is otherwise banned for export to China. The bundled chips are shipped to Hong Kong and carried across the border into Shenzhen, where workshops desolder the boards to extract the valuable HBM and discard the rest, according to The Information.
tomshardware.com
· 2026-11-03
SK Hynix reported third-quarter revenue of 104.62 trillion won and operating profit of 83.33 trillion won, both well above analyst estimates compiled by LSEG. Revenue grew 327.9% and operating profit 632.1% from a year earlier, driven largely by sales of high-bandwidth memory chips used in AI systems. The results follow an August announcement of a 40 trillion won share buyback and cancellation plan alongside a higher shareholder return target.
cnbc.com
· 2026-10-27
Micron has dropped 4F2 memory cells from its roadmap and instead plans to introduce wafer bonding starting with its 1ε DRAM process, following the 1δ node due for volume production in late 2027. For later nodes, codenamed zeta angstrom and eta angstrom, Micron says it will adopt High-NA EUV lithography and new materials to keep shrinking DRAM cells. CTO Scott DeBoer said the company is also developing 3D DRAM alongside new memory types like vertical HBM and vertical edge inference memory for direct integration atop processors.
tomshardware.com
· 2026-10-26
Jensen Huang told CNBC he doesn't expect a memory oversupply by 2029, saying demand for memory such as HBM and LPDDR will keep rising as data centers expand. His comments came after memory stocks fell sharply following a South Korean opinion column that warned of a looming supply flood and potential AI downturn by 2029.
cnbc.com
· 2026-10-22
Chinese memory chipmaker CXMT saw its shares close 7.8% lower Monday despite forecasting net profit of 131-132.5 billion yuan ($19.58 billion) for the first nine months of 2026, reversing a 5.28 billion yuan loss a year earlier. The company also projected revenue of roughly 265-270 billion yuan, a jump of over 230 billion yuan from the same period last year, according to a regulatory filing.
cnbc.com
· 2026-10-19
IDC Global data shows worldwide PC shipments dropped 20.1% year-over-year in Q3 2026, a loss of 15.8 million units, and fell 9.1% from the prior quarter. The firm attributes this to a severe memory chip shortage driven by manufacturers shifting production toward AI data center components like HBM, which has pushed DDR5 memory prices up by as much as 500%.
tomshardware.com
· 2026-10-09
AMD's CEO Lisa Su is visiting South Korea to negotiate additional HBM memory supply for AI hardware, following a recent memorandum of understanding with Samsung. Samsung is also interested in broadening its collaboration with AMD to include foundry manufacturing and other semiconductor technologies. The discussions highlight ongoing efforts to secure long-term supply chains amid rising AI demand.
tomshardware.com
· 2026-10-08
Micron CEO Sanjay Mehrotra said demand will outstrip supply for DRAM and NAND through 2027 and 2028, even tighter than in 2026, with most of next year's capacity already sold. Despite planned shipment growth in the low-to-mid 20% range, the company says it has no visibility into when supply and demand will balance, while forecasting record fiscal-quarter revenue of $61.5 billion and an 86.25% gross margin.
hardware.slashdot.org
· 2026-10-01
Micron CEO Sanjay Mehrotra told investors that demand for the company's memory will outstrip supply for at least the next couple of years, driven by business sales of high-bandwidth memory and DRAM for AI and servers. He said 75% of Micron's 2027 output is already committed, with most current sales talks focused on 2028, and new clean rooms won't open until 2028 with only gradual production ramp-up afterward. Samsung executives reportedly made similar comments this week about a prolonged memory shortage.
arstechnica.com
· 2026-10-01
OKI Circuit Technology announced it has developed 124-layer printed circuit board technology for wafer inspection equipment used with next-generation high bandwidth memory (HBM) found in AI semiconductors, a roughly 15% increase over its previous 108-layer design. The company says it achieved this within the existing 7.6mm thickness limit by creating ultra-thin materials, handling tools, and a proprietary automated transport system. OTC aims to establish mass production of the technology by October 2025 at its Joetsu Plant in Niigata Prefecture.
oki.com
· 2026-10-01
During its FY2026 earnings call, Micron said RAM and NAND shortages will intensify through 2027 and 2028, with CEO Sanjay Mehrotra stating demand will keep outpacing supply despite planned shipment growth in the low-to-mid 20% range. The company also guided for record FQ1 revenue of $61.5 billion and an 86.25% gross margin, implying over $53 billion in gross profit and projected EPS of $38.15 per share.
tomshardware.com
· 2026-10-01
Micron reported fiscal fourth-quarter revenue of $54.23 billion, up 379% year-over-year and ahead of the $51.07 billion analysts expected, with adjusted earnings per share of $33.42 versus a $31.61 forecast. The company said tight supply conditions for memory chips, driven by AI demand, should persist and even intensify into fiscal 2027.
cnbc.com
· 2026-10-01
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