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Huawei chairman thanks the US for export restrictions on chips, says it supercharged China’s semiconductor industry — Washington’s export controls encouraged Chinese firms to invest in R&D and build their own tech stack competing with American tech (tomshardware.com)
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Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management (tomshardware.com)
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Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law (tomshardware.com)
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