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1.
TSMC, Samsung, and Intel shore up support with ASML to deploy larger High-NA EUV photomasks — 6×12-inch photomask transition may take years despite unified effort (tomshardware.com)
2.
ASML targets 2033 for High-NA EUV with larger masks, promising a 40% productivity gain (techspot.com)
3.
Top chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change (arstechnica.com)
4.
Jim Cramer calls this chipmaker one of his top 6 stocks to buy now (cnbc.com)
5.
TSMC to start using High-NA EUV lithography in 2030 — A10 or A11 technology prime candidates for use (tomshardware.com)
6.
Samsung and TSMC hope AMSL's new machines will help address the chip shortage (engadget.com)
7.
TSMC, Samsung commit to ASML’s newest chipmaking tools as AI drives demand (cnbc.com)
8.
Intel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combined — company also trailblazing giant 6×12 photomasks to speed production and lower costs (tomshardware.com)
9.
Samsung Foundry updates process roadmap to move 1.4nm node to 2029 — high-NA EUV will enable 1nm-class and smaller nodes in 2030 and beyond (tomshardware.com)
10.
Intel Starts Shipping High-NA EUV Silicon (news.ycombinator.com)
11.
ASML's planned Low-NA EUV machine price hikes reportedly frustrate TSMC — lithography machine maker comes knocking to make bank on TSMC's profitable fabs, potentially costing the Taiwanese chipmaker billions (tomshardware.com)
12.
ASML looks to increase prices of its Low-NA EUV tools beyond existing productivity-based model — company wants to capture the value of all the advantages its tools offer, not just wafer throughput improvements (tomshardware.com)
13.
Rare ASML Special Edition Monopoly board unearthed in social media trade — enthusiast swaps 2007 employee gift for High-NA EUV Lego kit (tomshardware.com)
14.
Imec builds world's first High-NA EUV-fabricated quantum dot qubit device — breakthrough could pull quantum computing onto the same manufacturing roadmap as next-gen AI processors, compressing timelines (tomshardware.com)
15.
ASML says first silicon from its latest $400M High-NA EUV machines is just months away (techspot.com)
16.
IBM and Lam's new partnership paves the way toward sub-1nm logic using High-NA EUV — Albany lab to pioneer dry resist process integration (tomshardware.com)
17.
Intel installs industry's first commercial High-NA EUV lithography tool — ASML Twinscan EXE:5200B sets the stage for 14A (tomshardware.com)
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