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1.

Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management (tomshardware.com)

2026-05-28 | by Luke James | get 3D Chip Design Software → | tags: huawei, logicfolding, peking university

2.

Forming Standards for a Better Future Working Together (computer.org)

2025-10-31 | by Jasmine Ang | get Microsoft Surface Pro → | tags: ai, peking, school

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