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A Look into Intel Xeon 6's Memory Subsystem

Intel’s server dominance has been shaken by high core count competition from the likes of AMD and Arm. Xeon 6, Intel’s latest server platform, aims to address this with a more scalable chiplet strategy. Chiplets are now arranged side by side, with IO chiplets on either side of the chip. It’s reminiscent of the arrangement Huawei used for Kunpeng 920, but apparently without the uniform chiplet height restrictions of Huawei’s design. Intel also scales up to three compute dies, as opposed to a maxi

Topics: die intel l3 latency xeon