GoKawiilSamsung and TSMC to adopt ASML's High NA EUV chipmaking tools by 2028-2030
Samsung and TSMC, the world's two largest chipmakers, have confirmed plans to deploy ASML's High NA extreme ultraviolet lithography systems, machines that can cost roughly $400 million each and etch finer circuit patterns onto silicon wafers. Samsung plans to use the tools for DRAM production starting in 2028 and expand its scaling roadmap by 2030, while TSMC expects broader adoption driven by increasingly complex transistor designs needed for AI chips. Both companies join Intel as customers of the technology.
GoKawiil's interpretation of the reporting above, not reported fact.
AI workloads are pushing chipmakers toward ever-smaller, more intricate transistor structures, and High NA EUV is seen as the tool that makes that next leap possible. For ASML, securing commitments from the industry's two biggest chipmakers resolves a long-standing investor question about whether demand for these expensive machines will materialize, potentially shaping the company's future capacity investment decisions.
- Samsung will use ASML's High NA EUV tools for DRAM from 2028 and broader scaling by 2030.
- TSMC expects rising adoption of the machines due to complex AI-driven chip architectures.
- The commitments give ASML clearer visibility on demand as it weighs further EUV capacity expansion.
Chip War by Chris Miller (book) — If ASML's $400 million EUV machines and the TSMC/Samsung race have you curious, Chip War is the definitive deep dive into how lithography and semiconductors became the world's most contested technology. It explains exactly why tools like High NA EUV are such a chokepoint for AI chips.
See Chip War by Chris Miller (book) on Amazon → Affiliate link — we may earn a commission on purchases, at no extra cost to you. Product picked by AI based on this article; it is not a tested recommendation.Source: cnbc.com — Arjun Kharpal, 2026-09-08
Published there as: “TSMC, Samsung commit to ASML’s newest chipmaking tools as AI drives demand”
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