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China's chipmakers extend DUV lithography to match EUV-class density, at a cost

Despite lacking access to ASML's EUV machines due to export controls, Chinese foundries have pushed older deep ultraviolet lithography to produce increasingly advanced chips. Analysis of Huawei's Kirin 9030 shows SMIC has achieved density approaching 5nm-class manufacturing using multiple patterning techniques on DUV tools, following its earlier 7nm-class Kirin 9000S chip. Experts including Fractilia's Chris Mack note this approach remains behind TSMC and Samsung's leading processes.

ASML speeds up equipment shipments for Musk's Terafab chip project

Elon Musk said ASML and other key semiconductor equipment suppliers have accelerated deliveries to support the Terafab chip plant being built jointly by Tesla and SpaceX. Speaking on SpaceX's Q3 2026 earnings broadcast on X, Musk targeted volume chip production at the Gibbons Creek, Texas facility by late 2028, with an experimental test chip expected from an Austin research fab around Q2 2027.

Fan-built 810-piece Lego replica of ASML's employee-only EUV kit appears on Rebrickable

A builder known as NightHawk11991 designed an 810-piece, 152-unique-part Lego replica of ASML's employee-exclusive TWINSCAN EXE:5000 High-NA EUV machine set, posting instructions on Rebrickable. The MOC adds interior details like vacuum pumps, a laser emitter and reflectors, plus a sliding wafer tray, and was shared publicly by X user @lithos_graphein, who said it took about a week to build.

Chinese startup Langdao Silex unveils prototype EUV light source

Langdao Silex, founded in 2024 by alumni of Tsinghua University's Gas Discharge Plasma Laboratory, showed off a prototype laser-produced plasma EUV light source called FlintNano LPP-OXXO at a Shanghai trade fair. The unit reportedly outputs over 15W with 90% domestically sourced components and can run continuously for more than 100 hours, but TrendForce reports commercialization is still three to five years away.

EU, China discuss swapping sanctions to save ASML supplier Sindlhauser

The EU is negotiating with China to lift export restrictions on German firm Sindlhauser Materials, a supplier to ASML, in exchange for the EU removing sanctions on an unnamed Chinese company accused of aiding Russia, according to Bloomberg sources. The talks occurred during EU Trade Commissioner Maroš Šefčovič's visit to Beijing, with the EU expected to act first, pending unanimous approval from member states.

ASML posts record $13 billion quarter, warns lithography demand will outstrip supply through 2028

ASML reported third-quarter 2026 revenue of $13.06 billion, up 55% year-over-year, with a record gross margin of 57.5% and operating income of $5.79 billion. The company sold 121 lithography systems in the quarter, with EUV and DUV tools split roughly evenly in revenue, and said it now expects customer demand to exceed its production capacity in 2027 and 2028.

ASML sees chipmaking equipment orders stretching into 2029-2030, will raise prices in 2027

ASML's Q3 2026 earnings showed net profit of €4.96 billion on €11.7 billion in sales, with CEO Christophe Fouquet saying customers are already booking advanced lithography machines for delivery in 2029 and 2030. The company will raise prices starting in 2027, fully reflected by 2028, even as it adds 30% capacity in both 2027 and 2028, and lifted its full-year sales guidance to €44-45 billion.

ASML says demand will outstrip planned chipmaking equipment supply through 2028

ASML CEO Christophe Fouquet said planned equipment supply for 2027 and 2028 will fall short of customer demand, even after a previously forecast 30% capacity increase by 2028. The company is exploring ways to expand capacity further, and some customers are already discussing orders stretching into 2029 and 2030. Separately, Samsung and TSMC committed in the third quarter to adopting ASML's High NA EUV lithography machines.

Terafab reportedly set to receive first ASML EUV tool by mid-2027

According to Tim Culpan, Elon Musk's Terafab chip project will receive its first ASML EUV lithography scanner in mid-2027. SemiAnalysis notes the development fab's shell at Giga Texas won't be finished until late 2027, meaning the tool could sit unused for months before installation begins.

ASML reports stronger-than-expected Q3 profit, sees customer orders stretching to 2030

ASML said some customers are expressing interest in placing orders for its lithography machines as far out as 2029 and 2030, citing rising short- and medium-term demand forecasts tied to AI investment. The company also reported third-quarter profit that exceeded analyst expectations.

TSMC Reports 54.6% Year-Over-Year Growth in September Chip Sales

Taiwan Semiconductor Manufacturing Co (TSMC) announced September revenue of approximately $16 billion, marking a 54.6% increase compared to the previous year but a slight decline of 0.6% from August. The company, a key supplier for Nvidia and Apple, has benefited from rising demand for AI chips and has committed to adopting ASML's advanced lithography technology for future chip manufacturing. Its third quarter revenue is expected to be around NT$1.49 trillion, with earnings to be released next week.

Report: China has amassed 343 ASML immersion DUV lithography tools since 2012

The Centre for Technology & Statecraft estimates Chinese chipmakers imported 343 immersion DUV lithography scanners from ASML between 2012 and early 2026, not counting equipment sent to multinational fabs operating in China. CTS says about 270 of these are Twinscan NXT:1980i machines, which offer resolution and overlay precision that could support 7nm-class chip production through multipatterning techniques.