GoKawiilChina's chipmakers extend DUV lithography to match EUV-class density, at a cost
Despite lacking access to ASML's EUV machines due to export controls, Chinese foundries have pushed older deep ultraviolet lithography to produce increasingly advanced chips. Analysis of Huawei's Kirin 9030 shows SMIC has achieved density approaching 5nm-class manufacturing using multiple patterning techniques on DUV tools, following its earlier 7nm-class Kirin 9000S chip. Experts including Fractilia's Chris Mack note this approach remains behind TSMC and Samsung's leading processes.
GoKawiil's interpretation of the reporting above, not reported fact.
The findings suggest export controls have slowed but not stopped China's progress toward cutting-edge chipmaking, as multiple patterning lets manufacturers substitute process complexity for missing equipment. This could mean the gap with Western chipmakers is narrowing in capability even as it widens in cost and yield, since repeated exposures raise defect rates and manufacturing time according to the report. The trend may inform future debates over the effectiveness of semiconductor export restrictions.
- SMIC has used multiple-patterning DUV lithography to approach 5nm-class density without EUV machines.
- Huawei's Kirin 9030 reportedly shows improvement over the earlier Kirin 9000S 7nm-class chip.
- Experts say the DUV-based approach still lags TSMC and Samsung while incurring higher costs and defect risks.
Source: tomshardware.com — Chris Stokel-Walker, 2026-10-23
Published there as: “China can make advanced chips without EUV, but the bill keeps growing”
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