Tom's Hardware's November 7 Premium roundup features an interview-driven look at why Apple is reportedly adding touch to OLED (PROLED) displays in 2026, a detailed breakdown of Micron's new DRAM and NAND roadmap including 1-delta DRAM made in the US and 400-plus-layer 11th-gen NAND, and a conversation with GlobalFoundries VP Sudipto Bose about its new FDX Fusion process, which uses DUV lithography to achieve 7nm-class performance.
tomshardware.com
· 2026-11-07
GlobalFoundries VP Sudipto Bose outlined the company's FDX Fusion technology, an FD-SOI-based process using advanced planar transistors to reach 7nm-class performance without EUV lithography. Bose said the process offers 8nm-class logic density, with commercial production planned to start in 2028 and high-volume manufacturing targeted for 2030.
tomshardware.com
· 2026-11-06
Despite lacking access to ASML's EUV machines due to export controls, Chinese foundries have pushed older deep ultraviolet lithography to produce increasingly advanced chips. Analysis of Huawei's Kirin 9030 shows SMIC has achieved density approaching 5nm-class manufacturing using multiple patterning techniques on DUV tools, following its earlier 7nm-class Kirin 9000S chip. Experts including Fractilia's Chris Mack note this approach remains behind TSMC and Samsung's leading processes.
tomshardware.com
· 2026-10-23
ASML reported third-quarter 2026 revenue of $13.06 billion, up 55% year-over-year, with a record gross margin of 57.5% and operating income of $5.79 billion. The company sold 121 lithography systems in the quarter, with EUV and DUV tools split roughly evenly in revenue, and said it now expects customer demand to exceed its production capacity in 2027 and 2028.
tomshardware.com
· 2026-10-15
ASML CEO Christophe Fouquet said planned equipment supply for 2027 and 2028 will fall short of customer demand, even after a previously forecast 30% capacity increase by 2028. The company is exploring ways to expand capacity further, and some customers are already discussing orders stretching into 2029 and 2030. Separately, Samsung and TSMC committed in the third quarter to adopting ASML's High NA EUV lithography machines.
techspot.com
· 2026-10-15
According to Tim Culpan, Elon Musk's Terafab chip project will receive its first ASML EUV lithography scanner in mid-2027. SemiAnalysis notes the development fab's shell at Giga Texas won't be finished until late 2027, meaning the tool could sit unused for months before installation begins.
tomshardware.com
· 2026-10-14
ASML CEO Christophe Fouquet said the effects of AI on chipmaking and society will unfold gradually over the next decade or more, not as an immediate surge. He pointed to planned upgrades including larger mirror apertures in ASML's EUV lithography systems and a shift toward vertically stacked circuit designs as ways manufacturers will keep improving chip density and performance.
techspot.com
· 2026-09-29
ASML executive Frank Heemskerk said the company sold no lithography systems to European customers in 2026, down from 1% of revenue in 2025 and 5% in 2024. He attributed this to a lack of new chip factory investment in Europe and said ASML is in talks with EU officials, including Ursula von der Leyen, about boosting demand for European-made chips.
tomshardware.com
· 2026-09-24
According to a JPMorgan note cited by Semi Doped, ASML has no plans to adopt free-electron laser (FEL) technology for extreme ultraviolet lithography, despite backing from Elon Musk for that approach. Instead, ASML is continuing to refine its existing laser-produced plasma (LPP) method, aiming to boost source power from around 500W to 1,000W and nearly double the rate of tin droplet generation to 100,000 per second.
tomshardware.com
· 2026-09-18
Kepler Computing, a seven-year-old San Jose startup, has emerged from stealth mode claiming a novel 3D-stacking method and proprietary material can boost memory chip density without relying on costly EUV lithography. The approach applies to both high-bandwidth memory used in AI systems and SRAM cache found in CPUs and GPUs, and can reportedly be built using existing fabrication plants rather than requiring new facilities.
wired.com
· 2026-09-09
ASML is developing a larger 12-inch mask format for its next-generation High-NA EUV lithography systems, letting them print chips as large as those made with current EUV tools. The company expects a pilot line by 2031 and high-volume production by 2033, with CTO Marco Pieters saying the shift could boost system productivity by 40% if the industry adopts it together.
techspot.com
· 2026-09-09
Samsung Electronics and TSMC have committed to deploying ASML's newest high-numerical-aperture EUV lithography systems, machines that can cost up to $400 million each. Both companies join Intel in adopting a related technical change expected to increase chip output on these machines by roughly 40 percent. Samsung plans to use the tools for memory chip production by 2028, while TSMC intends to apply the technology to its most advanced chips for customers like AMD, Apple, Nvidia and Qualcomm.
arstechnica.com
· 2026-09-08
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