Samsung and TSMC to adopt ASML's high NA EUV lithography machines
Samsung Electronics and TSMC have committed to deploying ASML's newest high-numerical-aperture EUV lithography systems, machines that can cost up to $400 million each. Both companies join Intel in adopting a related technical change expected to increase chip output on these machines by roughly 40 percent. Samsung plans to use the tools for memory chip production by 2028, while TSMC intends to apply the technology to its most advanced chips for customers like AMD, Apple, Nvidia and Qualcomm.
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High NA EUV represents the next major leap in chipmaking precision, enabling smaller transistor features needed for more powerful AI processors and consumer devices. With all three major foundry players now committed, ASML effectively locks in demand for its costliest equipment, reinforcing its monopoly position and shaping the pace of semiconductor advancement industry-wide.
- Samsung and TSMC will adopt ASML's high NA EUV lithography machines within the next several years.
- The chipmakers agreed to a technical shift expected to boost production efficiency by about 40 percent.
- ASML remains the sole supplier of this $400 million technology, critical for next-generation AI and consumer chips.
Chip War" by Chris Miller (book) — If ASML's $400 million EUV machines fascinate you, this Pulitzer-winning history explains exactly how a single Dutch company came to control the most critical tool in semiconductor manufacturing. It's the perfect companion for understanding why Samsung, TSMC, and Intel all racing to high-NA EUV is such a big deal for the global chip race.
See Chip War" by Chris Miller (book) on Amazon → Affiliate link — we may earn a commission on purchases, at no extra cost to you. Product picked by AI based on this article; it is not a tested recommendation.Source: arstechnica.com, 2026-09-08
Published there as: “Top chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change”
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