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Samsung and TSMC to adopt ASML's high NA EUV lithography machines

read original get Chip War" by Chris Miller (book) → more articles
GoKawiil Brief

Samsung Electronics and TSMC have committed to deploying ASML's newest high-numerical-aperture EUV lithography systems, machines that can cost up to $400 million each. Both companies join Intel in adopting a related technical change expected to increase chip output on these machines by roughly 40 percent. Samsung plans to use the tools for memory chip production by 2028, while TSMC intends to apply the technology to its most advanced chips for customers like AMD, Apple, Nvidia and Qualcomm.

Why It Matters

GoKawiil's interpretation of the reporting above, not reported fact.

High NA EUV represents the next major leap in chipmaking precision, enabling smaller transistor features needed for more powerful AI processors and consumer devices. With all three major foundry players now committed, ASML effectively locks in demand for its costliest equipment, reinforcing its monopoly position and shaping the pace of semiconductor advancement industry-wide.

Key Takeaways
Worth a Look

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Source: arstechnica.com, 2026-09-08

Published there as: “Top chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change”

Read the original report → The summary and analysis above are GoKawiil's own, written from reporting by the source above. Facts and quotes belong to the original publisher.