GoKawiilChina's chipmakers extend DUV lithography to match EUV-class density, at a cost
Despite lacking access to ASML's EUV machines due to export controls, Chinese foundries have pushed older deep ultraviolet lithography to produce increasingly advanced chips. Analysis of Huawei's Kirin 9030 shows SMIC has achieved density approaching 5nm-class manufacturing using multiple patterning techniques on DUV tools, following its earlier 7nm-class Kirin 9000S chip. Experts including Fractilia's Chris Mack note this approach remains behind TSMC and Samsung's leading processes.