GoKawiilSamsung to scale HBM4/HBM4E output, boosting glass carrier demand 2.5x in 2025
Samsung Electronics is planning to more than double production of its sixth-generation HBM4 and seventh-generation HBM4E memory chips next year, industry sources say. To support this, the company will raise outsourced cleaning of glass carriers—supports used to stabilize wafers during thinning—from 20,000 sheets monthly this year to 50,000 sheets monthly in 2025, continuing a trend that saw volumes double from 10,000 sheets last year.
GoKawiil's interpretation of the reporting above, not reported fact.
Glass carriers are a bottleneck material for HBM production because they prevent wafer warping as chipmakers stack ever more DRAM layers, and rising demand for them signals real capacity expansion rather than just marketing claims. This scale-up positions Samsung to compete more aggressively in the high-bandwidth memory market critical to AI chip supply chains, where demand from Nvidia and other AI hardware makers continues to surge.
- Samsung plans to more than double HBM4/HBM4E output in 2025 versus this year.
- Outsourced glass carrier cleaning volume will rise 2.5x, from 20,000 to 50,000 sheets monthly.
- Sixth- and seventh-generation HBM chips are expected to make up 80% of Samsung's HBM output.
Source: en.sedaily.com — Seo Jong-Gap, 2026-09-20
Published there as: “Samsung is expected to more than double output of its HBM4 and HBM4E DRAM”
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