GoKawiilSamsung to scale HBM4/HBM4E output, boosting glass carrier demand 2.5x in 2025
Samsung Electronics is planning to more than double production of its sixth-generation HBM4 and seventh-generation HBM4E memory chips next year, industry sources say. To support this, the company will raise outsourced cleaning of glass carriers—supports used to stabilize wafers during thinning—from 20,000 sheets monthly this year to 50,000 sheets monthly in 2025, continuing a trend that saw volumes double from 10,000 sheets last year.