GoKawiilGlobalFoundries to make silicon interposers for TSMC's CoWoS in $2B deal
GlobalFoundries and TSMC signed a five-year, $2 billion manufacturing agreement under which GlobalFoundries will produce silicon interposers for TSMC's CoWoS-S advanced packaging at its Malta, NY fab. Volume production is set to ramp in the first half of 2028, giving TSMC a U.S.-based source for these components.
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Having interposers made domestically could let TSMC customers market AI and HPC chips as fully built and packaged in the US, addressing supply-chain and policy pressure to localize advanced semiconductor manufacturing. The deal also signals GlobalFoundries deepening its role in advanced packaging, an area increasingly critical to AI chip performance alongside leading-edge logic fabrication.
- GlobalFoundries and TSMC signed a $2 billion, five-year deal for US-made silicon interposers.
- Production will take place at GlobalFoundries' Malta, NY facility, ramping in H1 2028.
- Interposers support TSMC's CoWoS-S packaging used in AI and high-performance computing chips.
Source: tomshardware.com — Anton Shilov, 2026-10-08
Published there as: “GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion”
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