GoKawiilGlobalFoundries to make silicon interposers for TSMC's CoWoS in $2B deal
GlobalFoundries and TSMC signed a five-year, $2 billion manufacturing agreement under which GlobalFoundries will produce silicon interposers for TSMC's CoWoS-S advanced packaging at its Malta, NY fab. Volume production is set to ramp in the first half of 2028, giving TSMC a U.S.-based source for these components.