GlobalFoundries details FDX Fusion planar FD-SOI process targeting 7nm-class performance by 2030
GlobalFoundries VP Sudipto Bose outlined the company's FDX Fusion technology, an FD-SOI-based process using advanced planar transistors to reach 7nm-class performance without EUV lithography. Bose said the process offers 8nm-class logic density, with commercial production planned to start in 2028 and high-volume manufacturing targeted for 2030.