GoKawiilOKI Circuit Technology develops 124-layer PCB for AI chip inspection tools
OKI Circuit Technology announced it has developed 124-layer printed circuit board technology for wafer inspection equipment used with next-generation high bandwidth memory (HBM) found in AI semiconductors, a roughly 15% increase over its previous 108-layer design. The company says it achieved this within the existing 7.6mm thickness limit by creating ultra-thin materials, handling tools, and a proprietary automated transport system. OTC aims to establish mass production of the technology by October 2025 at its Joetsu Plant in Niigata Prefecture.