GoKawiilMicron's G11 3D NAND to use wafer bonding, ship in late 2027
Micron announced its next-generation G11 3D NAND will enter mass production in the second half of 2027, roughly doubling bit density versus its current G9 generation while boosting I/O speeds by up to 50% and cutting per-bit data transfer energy by more than 25%. CTO Scott DeBoer said G11 will adopt wafer-on-wafer bonding technology, a manufacturing approach previously used by YMTC, exceeding 400 layers.