GoKawiilIntel details future roadmap for EMIB and Foveros chip packaging technologies
Intel's advanced packaging methods, EMIB and Foveros, now underpin most of its client and data center CPUs after debuting with 2017's Kaby Lake-G chips. The company's roadmap shows the two technologies evolving to be both more sophisticated for high-end products and simplified for cost-sensitive ones, while increasingly working together alongside new process nodes. Intel's stated long-term goal is building system-in-package designs as large as 12 reticles combining EMIB with Foveros Direct 3D.