GoKawiil
Tech News
AMD's CEO Lisa Su is visiting South Korea to negotiate additional HBM memory supply for AI hardware, following a recent memorandum of understanding with Samsung. Samsung is also interested in broadening its collaboration with AMD to include foundry manufacturing and other semiconductor technologies. The discussions highlight ongoing efforts to secure long-term supply chains amid rising AI demand.
OKI Circuit Technology announced it has developed 124-layer printed circuit board technology for wafer inspection equipment used with next-generation high bandwidth memory (HBM) found in AI semiconductors, a roughly 15% increase over its previous 108-layer design. The company says it achieved this within the existing 7.6mm thickness limit by creating ultra-thin materials, handling tools, and a proprietary automated transport system. OTC aims to establish mass production of the technology by October 2025 at its Joetsu Plant in Niigata Prefecture.
SK hynix is reportedly discussing options with Intel for U.S.-based chip production, including leasing space at Intel's under-construction Ohio One facility or forming a joint venture involving Intel and AI hyperscalers seeking HBM supply. The talks come as SK hynix expands its Indiana HBM packaging plant following its $26.5 billion Nasdaq listing, though neither company has confirmed the discussions.