Nagare Labs, a Georgia Tech spinout backed by Pat Gelsinger, has detailed a new memory cell called Z2RAM that it says combines SRAM-level speed with DRAM-level density, intended to sit directly atop AI chips. According to the founders' published research, the cell retained data for over 300 seconds at 85°C, and a first generation is projected to deliver 5x SRAM density, 14x DRAM speed, and 3x lower read energy than SRAM using six stacked layers.
tomshardware.com
· 2026-11-06
Samsung is building out its Pyeongtaek semiconductor campus, including a fourth fabrication plant, employing large construction crews under strict safety protocols. The company projects memory chip demand will keep rising through 2028, and workers like safety officer Choi Hye-rin describe steady, well-paid work at the site.
technologyreview.com
· 2026-10-20
Samsung quietly raised prices on the Galaxy S26, S26 Plus and S26 Ultra by $100 without an official announcement, though the Galaxy S26 FE and new foldables were unaffected. The 512GB Galaxy S26 now costs $1,200, the S26 Plus $1,400, the S26 Ultra $1,600, and the 1TB S26 Ultra jumped $200 to $2,000.
cnet.com
· 2026-10-01
Micron reported that its DRAM revenue climbed 343% compared with the same period last year, driven by rising memory prices and strong demand. The company is the only U.S.-based manufacturer of high-bandwidth memory, a chip type increasingly used in AI systems.
gizmodo.com
· 2026-10-01
Reuters reported that SK Hynix is in early talks with Intel to produce memory chips in the United States, potentially through leasing space at Intel's Ohio plant or forming a joint venture involving cloud companies. Shares of both firms rose in premarket trading following the report, though sources cautioned no final decisions have been made.
cnbc.com
· 2026-09-16
Kepler Computing, a seven-year-old San Jose startup, has emerged from stealth mode claiming a novel 3D-stacking method and proprietary material can boost memory chip density without relying on costly EUV lithography. The approach applies to both high-bandwidth memory used in AI systems and SRAM cache found in CPUs and GPUs, and can reportedly be built using existing fabrication plants rather than requiring new facilities.
wired.com
· 2026-09-09
Samsung Electronics showed mockups of two new 3D memory designs, zHBM and zNAND-O, at the FMS 2026 conference in California. zHBM vertically stacks high-bandwidth memory directly on top of AI accelerator chips along the z-axis, cutting the distance data travels between memory and processor compared to today's side-by-side layouts.
thelec.net
· 2026-09-07
SK Hynix held a groundbreaking ceremony at Purdue University in West Lafayette, Indiana, for its first U.S. facility, a $4 billion plant dedicated to packaging high-bandwidth memory chips. CEO Kwak Noh-Jung said the site will become a key American production base for HBM by 2030, with its first cleanroom expected to open in October 2028, though actual chip manufacturing will still occur in South Korea and China.
cnbc.com
· 2026-08-27
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