GoKawiil
Tech News
Huawei and Qualcomm announced a multi-year patent license agreement covering cross licenses across 5G, compute, AI and networking patent portfolios. The deal also includes Qualcomm's purchase of certain Huawei US patents in compute, AI, networking and other fields, pending regulatory approval.
DeepSeek, working with Huawei, has published open-source programming libraries for Huawei's Ascend AI chips, including DeepGEMM-Ascend for matrix computations and DeepEP-Ascend for chip-to-chip communication, plus Ascend support for the TileLang programming language. The tools were developed and tested on Ascend 950 hardware, including a 128-chip supernode system, according to a September 30 Reuters report.
Huawei unveiled the Mate 90, Mate 90 Pro, Mate 90 Pro Max, and Mate 90 RS Ultimate Design phones alongside a separate accessory called the Ruiying Z10. The Z10 attaches magnetically via a 'HyperClick' mount to the Mate 90 Pro Max Collector's Edition and Mate 90 RS Master Edition, adding a one-inch 50MP RYYB sensor with continuous optical zoom from 24mm to 240mm (roughly 1x to 10x) and a variable f/2.0-f/4.5 aperture.
Huawei chairman Richard Yu told Chinese media the company plans moderate price increases, citing roughly $200 in added costs per device from rising memory and component prices that have hurt profitability. The comment came alongside the launch of Huawei's Mate 90 series, including a special edition priced near $2,835 and a detachable 10x optical zoom camera module.
Huawei has released the Ruiying Z10, an attachable lens for its Mate 90 Pro Max collector's edition and Mate 90 RS phones that contains a 1-inch-type, 50-megapixel RYYB sensor larger than any sensor in the phone itself. The accessory offers a true variable 24-240mm zoom with f/2.0-f/4.5 aperture, screws directly onto the phone's camera island without needing a case, and weighs 346g while costing roughly $895.
Reports indicate Huawei and other Chinese smartphone makers saw increased demand for their foldable devices following the announcement of Apple's iPhone Duo. China is emerging as a key battleground where Apple will compete against established domestic foldable brands.
HONOR has quietly released the Life S3, a 3.68-inch E Ink display that magnetically attaches to the back of any phone using an included magnetic ring. The device supports Wi-Fi 6 book transfers, microSD cards up to 1TB, and claims up to 30 hours of reading on its 650mAh battery, running a custom RTOS with JD Reading preinstalled.
Leakers Digital Chat Station and Ice Universe report that Huawei's Mate 90 Pro Max will have a special edition variant supporting a detachable external camera accessory. Unlike telephoto extender lenses used on rival phones, this add-on reportedly has its own 1-inch sensor with continuous optical zoom from 24mm to 240mm (1x-10x) and an aperture ranging from f/2.0 to f/4.5.
Ahead of Xi Jinping's first U.S. state visit in over a decade, Huawei moved forward the release of its next AI chip by three quarters, Alibaba launched what it called China's most powerful AI processor, and DeepSeek reportedly assembled the largest known cluster of Huawei chips. The releases come as Washington continues restricting China's access to advanced Nvidia chips and chipmaking equipment.
Leaker Ice Universe reports that Samsung's Galaxy S26 Ultra uses four-way baffles to block screen visibility from top, bottom and both sides, while Huawei's Mate XT 2 and Xiaomi's 18 Pro series only block side views. This makes Samsung's privacy screen more thorough, but the tighter light control brings side effects like dimmer off-axis brightness, blurrier images, and reported eye strain or nausea for some users.
Huawei says it will not sell its upcoming Ascend 900-series AI accelerators internationally because it cannot yet meet domestic Chinese demand for the chips. Chairman Eric Xu said the company only ships limited volumes to a few countries with especially strong demand. The announcement came alongside a roadmap showing major performance gains for the Ascend 960, 970 and 980 NPUs through 2027.
At Huawei Connect, Huawei revised its AI accelerator roadmap, moving up the release of its next-generation Ascend 960 NPUs by several quarters while also disclosing specifications for the upcoming Ascend 970 and 980 chips. The company also introduced a new Peerium interconnect architecture built on UnifiedBus and expanded its broader AI infrastructure lineup, including CPUs and SuperPoD systems.