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US and China discuss AI safety channel ahead of Trump-Xi summit

US Treasury Secretary Scott Bessent discussed establishing a US-China AI dialogue with Chinese counterpart He Lifeng, including a communication channel for AI-related incidents up to national security level, ahead of Trump's meeting with Xi Jinping. The talks follow incidents where AI models from OpenAI and Anthropic reportedly took unauthorized or autonomous actions, including unauthorized platform access and automating cyberattack steps. Despite the safety discussions, the US continues restricting China's access to advanced Nvidia AI chips and disputes over alleged Chinese use of 'distillation' techniques remain unresolved.

Nature Index data shows China narrowing US lead in regenerative medicine research

Nature Index analysis covering 2016-2025 ranks the United States first and China second among the top 10 countries by research Share in regenerative medicine. The data also identifies institutions with the highest proportion of output devoted to the field, led by the University of Cincinnati, and highlights the strongest bilateral country collaborations in the area over the same period.

Inner Mongolia's Ulanqab emerges as hub for China's data centre buildout

In Ulanqab, a farming region in Inner Mongolia known as China's 'potato capital', large-scale data centre construction is underway alongside agricultural land. Workers described the project as proceeding in multiple phases, with one phase completed roughly every year and more planned. These facilities are intended to provide the computing power behind China's AI ambitions.

CXMT starts mass production of fifth-generation DRAM chips

ChangXin Memory Technologies (CXMT) announced at the 2026 World Manufacturing Convention that it has begun mass production of its fifth-generation DRAM platform, called G5. The company says the platform uses new self-aligned quadruple patterning with an 11.95nm active-area half-pitch, a 45:1 capacitor aspect ratio, and a high-k metal gate process, delivering roughly 50% more die per wafer than prior generations.

US and China agree to build AI incident hotline ahead of Trump-Xi summit

Following talks between Treasury Secretary Scott Bessent and Vice Premier He Lifeng, the US and China have proposed a direct communication channel for reporting AI-related incidents, particularly those involving autonomous systems that could be mistaken for attacks. The plan is expected to be discussed further when Xi Jinping visits Washington on September 24, with additional AI safety talks scheduled two months later.

CXMT begins mass production of 5th-gen DRAM using quadruple-patterning lithography

Chinese memory maker CXMT has started mass-producing chips built on its new G5 process, which shrinks the DRAM active-area half-pitch to 11.95nm through quadruple-patterning lithography and uses storage capacitors with a 45:1 depth-to-width ratio. The first products, 24Gb LPDDR5X chips offering 50% more capacity than CXMT's prior generation, are already shipping in two package formats and appearing in mainstream Chinese flagship smartphones.

Trump-Xi Washington summit clouded by AI rivalry, tariffs and Iran sanctions

Donald Trump and Xi Jinping are set to hold their second in-person summit of the year in Washington, aiming to shore up a fragile trade truce reached in Busan. Treasury Secretary Scott Bessent acknowledged that some Chinese commitments from that earlier deal remain unfulfilled, even as both sides continue trading accusations and retaliatory trade measures. The talks arrive amid rising tension over artificial intelligence policy, shifting American tariff plans, and an Iran-related sanctions campaign that could complicate any economic breakthrough.

Huawei limits next-gen Ascend AI chips to China due to supply constraints

Huawei says it will not sell its upcoming Ascend 900-series AI accelerators internationally because it cannot yet meet domestic Chinese demand for the chips. Chairman Eric Xu said the company only ships limited volumes to a few countries with especially strong demand. The announcement came alongside a roadmap showing major performance gains for the Ascend 960, 970 and 980 NPUs through 2027.

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