Skip to content
Tech News
clear
Topics: Today This Week This Month This Year
1.
Food packaging is entering a new era of scrutiny (feeds.feedburner.com)
2.
Is it time to stop using glue and labels on paper? (feeds.bbci.co.uk)
3.
TSMC says it may build 12 Arizona chip plants in total, but be skeptical (9to5mac.com)
4.
Micron commits $500 million to GlobalWafers' Texas wafer plant as it raises U.S. spending to $250 billion — memory maker aims to manufacture 40% of DRAM in the US by 2035 (tomshardware.com)
5.
Is Your ‘Eco-friendly’ Paper Bag Actually Sustainable? No — and Here’s the Math to Prove It. (feeds.feedburner.com)
6.
Nvidia and Intel tout homegrown American chip supply chain prowess as country bolsters local production, but gaps remain — crucial Blackwell packaging steps remain offshore as projects grow in scope and scale (tomshardware.com)
7.
Factories are just rooms (news.ycombinator.com)
8.
Massive Apple leak just gave us even more alleged iPhone 18 Pro images, showing off colors and more (androidauthority.com)
9.
Want Dinner Fast? This Is the Best Meal Kit Service for Quick-Fire Recipes (cnet.com)
10.
Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business with dedicated leadership' (tomshardware.com)
11.
TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package (tomshardware.com)
12.
4 Kitchen Tools That May Be Adding Microplastics to Every Meal You Cook (cnet.com)
13.
Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration (tomshardware.com)
14.
Analysis of trade-offs of post-sorting plastic packaging (feeds.nature.com)
15.
Marc Jacobs Beauty is back and the packaging is (finally) as bold as the makeup (feeds.feedburner.com)
16.
Blue Apron Review: Is This Revamped Meal Kit Still Worth It? (cnet.com)
17.
Tempo Promo Code: 60% Off Ready-to-Heat Meals in 2026 (wired.com)
18.
Bob’s Red Mill gets a charming logo redesign to stand out on store shelves (feeds.feedburner.com)
19.
Samsung Featured Dua Lipa on Its TV Packaging. Now, She's Suing for $15M (cnet.com)
20.
Dua Lipa is suing Samsung for $15 million (engadget.com)
21.
When semiconductor materials misbehave (news.ycombinator.com)
22.
Whataburger’s redesigned packaging proves the Happy Meal could be happier (feeds.feedburner.com)
23.
Energizer’s new coin batteries won’t cause ingestion burns if swallowed (theverge.com)
24.
How Garage Beer designed its delightfully retro glass bottles (feeds.feedburner.com)
25.
Tempo Promo Code: 60% Off Ready-to-Heat Meals in April 2026 (wired.com)
26.
Advanced Packaging Limits Come into Focus (news.ycombinator.com)
27.
The problem with Earth Month isn’t greenwashing (feeds.feedburner.com)
28.
AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan (cnbc.com)
29.
Intel is in talks with Google and Amazon to power AI chips with new packaging tech (techspot.com)
30.
Intel is going all-in on advanced chip packaging (arstechnica.com)
Today's top topics: google apple spacex openai code android billion anthropic meta model
View all today's topics →