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1.
China may have reverse engineered EUV lithography tool in covert lab, report claims — employees given fake IDs to avoid secret project being detected, prototypes expected in 2028 (tomshardware.com)
2.
Chinese scientists discover method to cut defects by 99% with DUV chipmaking equipment, but it destroys EUV pattern fidelity — analyzing photoresist clustering with cryo-ET at 105°C (tomshardware.com)
3.
American startup Substrate promises 2nm-class chipmaking with particle accelerators, at a tenth of the cost of EUV — X-ray lithography system has potential to surpass ASML's EUV scanners (tomshardware.com)
4.
Chips, AI, and Geopolitics: Inside ASML’s Surprising Mistral Investment (techreport.com)
5.
Startup aims to shrink particle accelerators to transform semiconductor manufacturing (techspot.com)
Today's top topics: deal bytedance investors google apple tiktok memo security camera fold
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