Tom's Hardware's November 7 Premium roundup features an interview-driven look at why Apple is reportedly adding touch to OLED (PROLED) displays in 2026, a detailed breakdown of Micron's new DRAM and NAND roadmap including 1-delta DRAM made in the US and 400-plus-layer 11th-gen NAND, and a conversation with GlobalFoundries VP Sudipto Bose about its new FDX Fusion process, which uses DUV lithography to achieve 7nm-class performance.
tomshardware.com
· 2026-11-07
Jim Cramer said on CNBC's Mad Money that a two-day sell-off in AI-related stocks stems from investors' inability to value companies tied to data center growth. The decline hit chipmakers and infrastructure suppliers broadly, with the iShares Semiconductor ETF falling 10% Thursday after a 3% drop Wednesday, and GE Vernova and Sandisk sliding 7% and 22% respectively.
cnbc.com
· 2026-11-05
CNBC's Jim Cramer said Thursday's slide in AI-related stocks, which saw Micron fall 17%, GE Vernova drop 7% and Sandisk plunge 22%, likely isn't finished. He attributed the declines to rising local opposition to new data centers after the midterm elections, which has raised doubts about continued AI infrastructure spending, but said he does not view this as a repeat of the dot-com crash since most affected companies are profitable.
cnbc.com
· 2026-11-05
TrendForce reports conventional DRAM contract prices jumped roughly 93-98% quarter over quarter in early 2026, driven partly by manufacturers shifting production toward AI data center memory. Micron exited its Crucial consumer RAM business this year citing AI demand, while HP says memory and storage will make up about 35% of its PC component costs in 2026, up from 15-18% previously, and has warned of PC price hikes. Used DDR4 kits offer some savings over new ones but still cost far more than in 2020.
engadget.com
· 2026-11-02
Micron Taiwan is issuing a lump-sum payout combining an annual performance bonus, a mass-production bonus, and a one-time $31,000 appreciation bonus, with about 700 of its 4,300+ production workers receiving the equivalent of five years' salary. The remaining staff will get the same three bonuses in October, and Micron also plans a new quarterly profit bonus starting January 2027, split 50% cash and 50% stock.
tomshardware.com
· 2026-10-30
SK Hynix's New York-listed shares surged more than 13% following better-than-expected quarterly results and an upbeat forecast, sending other chipmakers like Micron, Arm and AMD higher as well. The company reported revenue about 6% above estimates, gross margins of 85.7%, and forecast shipment growth accelerating to the mid-20% range, while saying production is largely committed through 2029.
cnbc.com
· 2026-10-28
Memory and data storage stocks, including Micron, SanDisk and SK Hynix, rose today after pulling back from record highs reached this summer. The gains follow a stretch of declines for memory chip makers in recent weeks.
fastcompany.com
· 2026-10-28
Reports indicate Micron is stepping back from developing 4F² DRAM cell designs even as rival memory makers continue investing in the technology. The move marks a divergence in approach among major DRAM manufacturers over next-generation memory scaling techniques.
hothardware.com
· 2026-10-26
Micron has dropped 4F2 memory cells from its roadmap and instead plans to introduce wafer bonding starting with its 1ε DRAM process, following the 1δ node due for volume production in late 2027. For later nodes, codenamed zeta angstrom and eta angstrom, Micron says it will adopt High-NA EUV lithography and new materials to keep shrinking DRAM cells. CTO Scott DeBoer said the company is also developing 3D DRAM alongside new memory types like vertical HBM and vertical edge inference memory for direct integration atop processors.
tomshardware.com
· 2026-10-26
Micron announced its next-generation G11 3D NAND will enter mass production in the second half of 2027, roughly doubling bit density versus its current G9 generation while boosting I/O speeds by up to 50% and cutting per-bit data transfer energy by more than 25%. CTO Scott DeBoer said G11 will adopt wafer-on-wafer bonding technology, a manufacturing approach previously used by YMTC, exceeding 400 layers.
tomshardware.com
· 2026-10-23
Micron has laid out its memory and storage roadmap through 2027, centered on a new 1-Delta DRAM manufacturing node offering roughly 25% higher bit density than its current 1-Gamma process. The company says 1-Delta will support DDR6, with more than double DDR5's bandwidth, and LPDDR6, claimed to be 35% more power-efficient than LPDDR5, alongside plans for 1TB RDIMMs and NAND exceeding 400 layers. Micron says volume production of 1-Delta is expected in the second half of 2027, with no official DDR6 launch date set yet.
techspot.com
· 2026-10-23
Micron CTO Scott DeBoer said the company has decided not to pursue 4F² DRAM cell technology, which it invented, citing increased manufacturing complexity and cost without meaningful density gains. The announcement came during a company event, diverging from rivals Samsung and SK hynix, who reportedly still include 4F² designs in their roadmaps according to TechInsights.
tomshardware.com
· 2026-10-22
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