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91.
SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains (tomshardware.com)
92.
SK hynix expands U.S. presence with new Bellevue, Seattle office in efforts to get closer to its largest customers — offices near Nvidia, Amazon, and Microsoft highlight co-designed HBM efforts (tomshardware.com)
93.
Here's why HBM is coming for your PC's RAM — HBM consumes around three times the wafer capacity of DDR5 per gigabyte, as AI supercharges demand for chips and advanced packaging (tomshardware.com)
94.
Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals (tomshardware.com)
95.
Apple Engineers Are Inspecting Bacon Packaging to Help Level Up US Manufacturers (wired.com)
96.
Apple in early talks to assemble and package iPhone chips in India: report (9to5mac.com)
97.
'Outlet' RAM sold in Japan as new with huge markups, scuffed packaging — Crucial DDR5-5600 64GB kit commands $600 overseas as AI shortage bites (tomshardware.com)
98.
Common Lisp, ASDF, and Quicklisp: packaging explained (news.ycombinator.com)
99.
Intel boosts India's chip push with new Tata Group strategic partnership — includes manufacturing and packaging of Intel products for local markets (tomshardware.com)
100.
TSMC could be inching closer to making 'all American' chips — report says it is accelerating an advanced packaging facility in Arizona (tomshardware.com)
101.
TSMC's CoWoS packaging capacity reportedly stretched due to AI demand — Intel's EMIB and Foveros eyed as potential solution to bottleneck (tomshardware.com)
102.
Apple and Broadcom job listings suggest potential Intel Foundry collaborations — requirements highlight expertise in Intel's EMIB and 2.5D memory packaging tech (tomshardware.com)
103.
Wolfenstein 3D publisher recalls fight to distribute game in Germany — porn stores and plain packaging came to the rescue of 1990s FPS gamers (tomshardware.com)
104.
Eating Microwave Popcorn in 2025? You Can Do Better (wired.com)
105.
Could the XZ backdoor been detected with better Git/Deb packaging practices? (news.ycombinator.com)
106.
Gizmodo Science Fair: A Non-Toxic Alternative to ‘Forever Chemicals’ (gizmodo.com)
107.
PYX: The next step in Python packaging (news.ycombinator.com)
108.
Could aluminium become the packaging 'champion'? (feeds.bbci.co.uk)
109.
Thawing vacuum-packed fish correctly (2024) (news.ycombinator.com)
110.
Debcraft – Easiest way to modify and build Debian packages (news.ycombinator.com)
111.
Automatically Packaging a Haskell Library as a Swift Binary XCFramework (news.ycombinator.com)
112.
Microplastics shed by food packaging are contaminating our food, study finds (news.ycombinator.com)
Today's top topics: openai anthropic apple ai safety google ios 27 dario amodei iphone 18 pro nvidia microsoft
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