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Topic Analysis: Today This Week This Month This Year
1.
Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals (tomshardware.com)
2.
Apple in early talks to assemble and package iPhone chips in India: report (9to5mac.com)
3.
TSMC could be inching closer to making 'all American' chips — report says it is accelerating an advanced packaging facility in Arizona (tomshardware.com)
4.
New Mac browser Orion is inspired by Apple with speed, privacy, and WebKit (9to5mac.com)
5.
Kagi Hub Belgrade (news.ycombinator.com)
6.
Orion 1.0 (news.ycombinator.com)
7.
Orion 1.0 – Browse Beyond (news.ycombinator.com)
8.
TSMC's CoWoS packaging capacity reportedly stretched due to AI demand — Intel's EMIB and Foveros eyed as potential solution to bottleneck (tomshardware.com)
9.
Kagi Assistants (news.ycombinator.com)
10.
Introducing Kagi Assistants (news.ycombinator.com)
11.
Eating Microwave Popcorn in 2025? You Can Do Better (wired.com)
12.
Gizmodo Science Fair: A Non-Toxic Alternative to ‘Forever Chemicals’ (gizmodo.com)
13.
Could aluminium become the packaging 'champion'? (feeds.bbci.co.uk)
14.
Thawing vacuum-packed fish correctly (2024) (news.ycombinator.com)
15.
Debcraft – Easiest way to modify and build Debian packages (news.ycombinator.com)
16.
How I Use Kagi (news.ycombinator.com)
Today's top topics: apple google amazon android code game battery model billion chatgpt
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