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1.
Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business with dedicated leadership' (tomshardware.com)
2.
TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package (tomshardware.com)
3.
4 Kitchen Tools That May Be Adding Microplastics to Every Meal You Cook (cnet.com)
4.
Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration (tomshardware.com)
5.
Show HN: Uruky (EU-based Kagi alternative) now has Image Search and URL Rewrites (news.ycombinator.com)
6.
Analysis of trade-offs of post-sorting plastic packaging (feeds.nature.com)
7.
An Update on Composer and Packagist Supply Chain Security (news.ycombinator.com)
8.
Marc Jacobs Beauty is back and the packaging is (finally) as bold as the makeup (feeds.feedburner.com)
9.
Using Kagi Search with Low Vision (news.ycombinator.com)
10.
Blue Apron Review: Is This Revamped Meal Kit Still Worth It? (cnet.com)
11.
Tempo Promo Code: 60% Off Ready-to-Heat Meals in 2026 (wired.com)
12.
Bob’s Red Mill gets a charming logo redesign to stand out on store shelves (feeds.feedburner.com)
13.
Samsung Featured Dua Lipa on Its TV Packaging. Now, She's Suing for $15M (cnet.com)
14.
Dua Lipa is suing Samsung for $15 million (engadget.com)
15.
When semiconductor materials misbehave (news.ycombinator.com)
16.
Whataburger’s redesigned packaging proves the Happy Meal could be happier (feeds.feedburner.com)
17.
Energizer’s new coin batteries won’t cause ingestion burns if swallowed (theverge.com)
18.
How Garage Beer designed its delightfully retro glass bottles (feeds.feedburner.com)
19.
Tempo Promo Code: 60% Off Ready-to-Heat Meals in April 2026 (wired.com)
20.
Advanced Packaging Limits Come into Focus (news.ycombinator.com)
21.
Kagi Product Tips – Customize Your Search Results with URL Redirects (news.ycombinator.com)
22.
The problem with Earth Month isn’t greenwashing (feeds.feedburner.com)
23.
AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan (cnbc.com)
24.
Intel is in talks with Google and Amazon to power AI chips with new packaging tech (techspot.com)
25.
Intel is going all-in on advanced chip packaging (arstechnica.com)
26.
Why TSMC grew four times faster than its foundry rivals in 2025 — price hikes, vertical integration, and commanding technology lead pay dividends (tomshardware.com)
27.
The Ridiculously Nerdy Intel Bet That Could Rake in Billions (wired.com)
28.
TSMC reportedly plans to build 12 fabs, four packaging facilities in Arizona — plan purportedly part of Taiwan's agreed $500 million investment in the US (tomshardware.com)
29.
What the New Starbucks ‘Widely Recyclable’ Label Really Means (gizmodo.com)
30.
Global semiconductor foundry market hit a record $320 billion in 2025 as TSMC pulled further ahead (tomshardware.com)
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